| 摘要 |
PROBLEM TO BE SOLVED: To provide a release film which improves a yield in a production process by preventing damage to electronic components due to peeling electrification generated in peeling a release film and preventing adherence of foreign matters to a film surface or an adhesive agent surface due to electrification, has less adhered foreign matters and is satisfactory in long-term durable adhesiveness.SOLUTION: There is provided a release film which has a constitution formed by providing a coating layer comprising one or more organic compounds containing at least one kind of metal element of zirconium or titanium and a &pgr;-conjugated conductive polymer resin and a release layer in this order on one surface of an at least uniaxially stretched polyester film, wherein the release layer has a surface specific resistance (R) of 1×10&OHgr; or less. |
