发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing generations of void.SOLUTION: A semiconductor device comprises: a plurality of semiconductor elements 10, 20, 31, 32 arranged in a first direction on a plane; a sealing resin 50 for sealing the semiconductor elements; a plurality of terminals 41b, 43b, 46, 47 electrically connected to the semiconductor elements and having parts protruding in the direction perpendicular to the first direction from a predetermined plane of the sealing resin when viewed from a direction vertical to the plane; and first and a second recessed parts 51, 52 that have shapes recessed to the semiconductor element side and are provided both sides of a resin injection port when a resin that be the sealing resin, is injected. Each of the first and the second recessed parts are arranged at locations opposite to one of the semiconductor elements respectively when viewed from a direction vertical to the plane and between terminals protruding at one of semiconductor elements side of the resin injection port. The first and a second recessed parts 51, 52 have: a penetrating part for penetrating the sealing resin in the direction perpendicular to the plane; and a step part formed on the semiconductor element side of the penetrating part and recessed by a predetermined depth from an upper plane of the sealing resin to the plane.
申请公布号 JP2014154780(A) 申请公布日期 2014.08.25
申请号 JP20130024868 申请日期 2013.02.12
申请人 TOYOTA MOTOR CORP;DENSO CORP 发明人 KADOGUCHI TAKUYA;OKUMURA TOMOMI
分类号 H01L21/56;H01L25/07;H01L25/18 主分类号 H01L21/56
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