| 摘要 |
PROBLEM TO BE SOLVED: To provide a module, with an electronic component built in a multilayer wiring board, which reduces effects of noise and heat generation and implements a compact device.SOLUTION: A module 100 includes: the multilayer wiring board including a plurality of wiring layers 14a-14i; and an electronic component 20 built in the multilayer wiring board. The wiring layers 14a-14i include a high frequency signal line 15 formed in an area overlapping the electronic component 20 when viewed in the direction of lamination of the multilayer wiring board. The electronic component 20 includes a component body electrically connected to the wiring layers 14a-14i, and a metal frame that surrounds side surfaces of the component body and does not cover an upper surface on the side of the high frequency signal line 15. |
