| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for reducing an amount of particles adhering to a substrate, by a simple configuration.SOLUTION: A substrate processing device 10 processes a substrate 9 by emitting a processing liquid from a nozzle 11. The substrate processing device 10 comprises: a supply pipe 30 whose one end is connected to the tank 21 of a processing liquid supply part 20, which supplies processing liquid, via a first filter F1 used for removal of particles and whose other end is connected to the nozzle 11; and an air bubble trapping part F2 interposed in the place between the first filter F1 and nozzle 11 in a supply pipe 30, and configured to trap air bubbles Ba1 contained in the processing liquid. Pressure loss PL2 by the air bubble trapping part F2 is substantially the same as pressure loss PL1 by the first filter, or is less than that. |
