| 摘要 |
PROBLEM TO BE SOLVED: To improve the substrate lifting ability while maintaining the substrate polishing performance.SOLUTION: A polishing device 100 includes: a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is applied; a liquid supply part which supplies a liquid 109 to a polishing surface of the polishing pad 108; a top ring 116 which absorbs the substrate 102 installed on the polishing surface through a liquid 109 supplied by the liquid supply part and transfers the substrate in a direction that separates from the polishing surface; and a control part which injects a gas (N) into an internal region 109a of the liquid 109 disposed between the substrate 102 and the polishing pad 108 when the substrate 102 is transferred. |
