SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a highly productive semiconductor device and a method of manufacturing the semiconductor device.SOLUTION: The method of manufacturing the semiconductor device according to an embodiment comprises the steps of: preparing a lower mold 11 having a recess 11a and a recess 11b for a terminal; disposing a heat sink 12 on the recess 11a of the lower mold 11 and disposing a control terminal 16 in the recess 11b for a terminal; wire-bonding a semiconductor element 13 provided on the heat sink 12 to the control terminal 16 in a state that the heat sink 12 is disposed on the lower mold 11; stacking an upper mold 21 over the lower mold 11 accommodating the heat sink 12; injecting a sealing resin 18 into between the lower mold 11 and the upper mold 21; and removing the upper mold 21 and the lower mold 11 from the sealing resin 18.