| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer flexible printed circuit board which satisfies a requirement of downsizing a product by reducing thickness of the product, improves yield and reduces the problem of cross-talk between electric circuits, and a method of manufacturing the same.SOLUTION: A multilayer flexible printed circuit board comprises: at least one electric circuit unit disposed on a vertical interval layer. At least both sides of the electric circuit unit are covered by a horizontal interval layer and another vertical interval layer formed from electric insulating layers. By using a non-pressing method to stack layer structures of the multilayer flexible printed circuit board, occurrence of a crevice between layers is reduced, yield is improved, thickness is reduced and a problem of cross-talk between electric circuits can be avoided.</p> |
