发明名称 METHOD FOR CURING THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, PREPREG USING THE SAME, METAL-CLAD LAMINATED PLATE, RESIN SHEET, PRINTED WIRING BOARD, AND SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for curing a thermosetting resin composition which can improve the curing speed in a resin composition containing a benzoxazine compound, a thermosetting resin composition, a prepreg using the same, a metal-clad laminated plate, a resin sheet, a printed wiring board, and a sealing material.SOLUTION: In a method for curing a thermosetting resin composition, a thermosetting resin composition contains not only a thermosetting resin containing a benzoxazine compound but also a curing accelerator containing a triazinethiol compound, as components of the thermosetting resin composition, and is heated and cured.
申请公布号 JP2014152262(A) 申请公布日期 2014.08.25
申请号 JP20130023572 申请日期 2013.02.08
申请人 PANASONIC CORP 发明人 FUJIWARA HIROAKI;KITAI YUKI;SAITO HIRONORI
分类号 C08G14/073;C08G59/40 主分类号 C08G14/073
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