发明名称 FILLING DEVICE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a filling device of novel structure.SOLUTION: A filing device fills a second component housing body with an electronic component housed in a first component housing body. The filing device includes second holding means, and feed means. The holding means holds the second component housing body so that the opening of the housing section is directed upward. The feed means opposes the openings of a plurality of housing sections of the first component housing body sequentially to the opening of the housing section of the second component housing body held by the holding means from above. With such a configuration, an electronic component housed in the first component housing body moves sequentially to the housing section of the second component housing body by its own weight. As a result, the housing section of the second component housing body is filled with a plurality of electronic components while being superposed.
申请公布号 JP2014154586(A) 申请公布日期 2014.08.25
申请号 JP20130020577 申请日期 2013.02.05
申请人 FUJI MACH MFG CO LTD 发明人 MIZUNO TAKAYUKI;KAWAI HIDETOSHI;ITO HIDETOSHI;TANAKA KEITA
分类号 H05K13/02;B65B15/04 主分类号 H05K13/02
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