SEMICONDUCTOR PROCESSING ADHESIVE TAPE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor processing adhesive tape, which is a dicing tape with adhesion sufficient to prevent chip fly during dicing and with the ability to easily be peeled during pickup, the semiconductor processing adhesive tape being designed to prevent contamination of a semiconductor element as a result of dissolution of adhesive even in a case where the adhesive is wet with a washing liquid for washing off a residue of the adhesive joining a support member to a semiconductor wafer in the manufacturing process of a semiconductor element using the support member.SOLUTION: In a semiconductor processing adhesive tape according to the present invention, a radiation-curable adhesive layer is formed on at least one side of a base material resin film. The semiconductor processing adhesive tape is characterized in that the contact angle of the adhesive layer to methyl isobutyl ketone before ultraviolet emission is not smaller than 25° but not larger than 180°.