| 摘要 |
<p>Disclosed is an LED package, for an LED package mounted with one or more LED chips, comprising a first body; a second body; and a first adhesive unit to bond and to insulate the first body and the second body, wherein the LED chip is mounted on at least one between the first body and the second body, and the first body and the second body are made of a respective integrated metal piece.</p> |
