ELECTROMAGNETIC BANDGAP STRUCTURE AND METHOD FOR MANUFACTURING THE ELECTROMAGNETIC BANDGAP STRUCTURE

摘要

Provided are an electromagnetic bandgap structure which includes a ground layer, a first power source layer which faces the upper side of the ground layer by interposing a dielectric in-between and includes one or more first patches and one or more first branches, and a second power source layer which faces the upper side of the first power source layer by interposing the dielectric in-between and includes one or more second patches and one or more second branches.