| 摘要 |
The purpose of the present invention is to provide a curable resin composition which has excellent breaking elongation, is low in both the arithmetic mean roughness and the root mean square roughness of the surface of an insulation layer in a wet roughening process, allows the formation of a plated conductor layer with sufficient peeling strength, and has a low coefficient of linear thermal expansion. Provided is a curable resin composition comprising (A) a phenoxy resin with a fluorene structure, (B) an epoxy resin, and a hardener (C). The hardener (C) comprises at least one hardener selected from a phenol hardener, a cyanate ester hardener and an active ester hardener. The content of the phenoxy resin (A) is 1-20 mass% with respect to 100 mass% of the total mass of the phenoxy resin (A), the epoxy resin (B), and the hardener (C). |
