| 摘要 |
Disclosed in the present invention is an apparatus for inspecting an image of a wafer, which comprises a lighting unit which periodically generates linear light; a lens unit which faces a wafer in order to obtain an image of the wafer that is reflected at a time when radiating the light to the wafer to be inspected; an image detecting unit where multiple unit image pickup devices are linearly aligned in order to directly photograph the wafer image that has passed through the lens unit; a wafer stage which grips and moves the wafer; a signal generating unit which controls the moving speed of the wafer stage in order to relate image detection position, where the wafer is exposed to the light, with a pulse generation cycle of the light; and an image processing unit which detects a defect on the wafer by processing the wafer image photographed by the multiple unit image pickup devices. According to the present invention, the image detecting unit is formed by linearly aligning and combining multiple unit image pickup devices and it is not necessary to use an optical element for dividing and distributing the space of the wafer image. Therefore, the entire composition is simplified and made compact, and installation and maintenance costs are reduced. |
