| 摘要 |
There is provided a curable resin composition that exhibits high adhesive properties to materials such as glass, copper, aluminum, PET, and PC, which have been regarded as poor adherends relative to photo-curable compositions, and high adhesive properties also between adherends different from each other. A curable resin composition including a polyene compound of Formula (1):;;(where n1, n2, and n3 are each independently an integer of 2 to 4; and R1 to R9 are each independently a hydrogen atom or a C1-10 alkyl group). The composition may further include a thiol compound or a photopolymerization initiator. The thiol compound may be a compound having two to six thiol groups in the molecule, or be an aliphatic thiol, or be produced by a reaction of an aliphatic mercapto carboxylic acid and a polyhydric alcohol. The polyhydric alcohol may be an aliphatic polyhydric alcohol or hydroxyalkyl isocyanurate. |
