LIFT OFF PROCESS FOR CONDUCTOR FOIL LAYER

摘要

A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components. A thin copper foil is then laminated over the substrate to adhere the foil to the adhesive pattern. The foil is then peeled off the substrate such that the foil overlying the adhesive pattern remains, and the foil that is not overlying the adhesive pattern is removed. In one embodiment, the foil is cut or weakened along the edges of the adhesive pattern to minimize tearing of the foil. The foil may be first affixed to a sheet for increased mechanical integrity, prior to the foil being laminated over the substrate, followed by kiss-cutting the foil while on the sheet to avoid tearing of the foil during the lift-off step.

主权项

1. A substrate metalization process comprising:
providing a substrate having a top surface; depositing an adhesive pattern on the top surface, the adhesive pattern corresponding to a metal foil pattern to be formed for interconnecting electronic components there to; laminating a metal foil over the substrate, including directly on the adhesive pattern to adhere the foil to the adhesive pattern; and lifting off the metal foil such that the foil overlying and adhering to the adhesive pattern remains after lifting off, and the foil that is not overlying the adhesive pattern and did not adhere to the adhesive pattern is removed, such that a resulting foil pattern substantially corresponds to the adhesive pattern.