发明名称 MEDIA-FREE, TEMPERATURE-ASSISTED ADHESIVE BONDING METHOD
摘要 <p>The invention relates to a media-free, temperature-assisted adhesive connection method for connecting polypropylene (PP)-based molded parts, profiled sections, strips, and/or films in order to form a mechanically machinable multilayer arrangement on a main part with a different geometric design. According to the invention, a first molded part, profiled section, strip, or film layer (2) is first applied onto the main part (1), wherein energy is locally applied to the layer face pointing towards the main part until the lower face melts and is then immediately fixed to the main part (1) under the effect of pressure. A second layer (2) is then applied onto the main part which has been provided with the first layer in a process in which solely the lower face of the second layer is melted by locally applying energy, the second layer is immediately brought into contact with the surface of the first layer, and the first and the second layer are connected using pressure. A third layer can subsequently be applied onto the main part which has been provided with the second layer in a process in which solely the lower face of the third layer is melted by locally applying energy, the third layer is immediately brought into contact with the surface of the second layer, and the second and the third layer are connected using pressure. The aforementioned sequence of steps is repeated with a fourth to an n-th layer until the desired total layer thickness of the multilayer arrangement is reached.</p>
申请公布号 CA2900410(A1) 申请公布日期 2014.08.21
申请号 CA20142900410 申请日期 2014.02.11
申请人 PRINTEC GMBH 发明人 STREICHARDT, THOMAS
分类号 B29C63/00;A47B96/20;B29C65/02 主分类号 B29C63/00
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