| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and a piezoelectric device, capable of achieving reduction in size and thickness which facilitates assembly, and of improving shock resistance against dropping.SOLUTION: An electronic component comprises: a semiconductor circuit board 81 mounting at least a semiconductor circuit; a circuit element 71 arranged on the semiconductor circuit of the semiconductor circuit board 81; and a lid part 61 attached onto the semiconductor circuit board 81. A reinforcement member 63 is integrally provided to the lid part 61. If a piezoelectric vibration element is mounted as the circuit element, a piezoelectric device can be configured. |
