| 摘要 |
PROBLEM TO BE SOLVED: To provide an infrared sensor capable of reducing the size. ! SOLUTION: An infrared sensor 1 includes: a sensor chip (sensor element) 5 receiving an infrared ray; an IC chip (circuit element) 6 that processes an output signal from the sensor chip (sensor element) 5; and a package 20 which stores the sensor chip 5 and the IC chip 6 and which has a light guide part 30 formed therein for allowing the infrared ray to the sensor chip 5. The sensor chip 5 is laminated in a thickness direction of the IC chip 6 (vertical direction). The sensor chip (a plane side) 5b includes: an infrared ray receiving part 52; and a connection bump (mounting part) 7 which is flip-chip-mounted on the IC chip 6 or package 20 formed on the bottom plane thereof. ! COPYRIGHT: (C)2014,JPO&INPIT |
