| 发明名称 |
SPEAKER ASSEMBLY AND ELECTRONIC DEVICE USING SAME |
| 摘要 |
A speaker assembly is configured for assembly to a housing. The housing defines a through hole and a receiving groove communicating with each other. The speaker assembly includes a speaker and a speaker cover. The speaker is received in the through hole. The speaker cover has an extending edge beyond a peripheral wall of the speaker and is received in the receiving groove. |
| 申请公布号 |
US2014233777(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201314014656 |
申请日期 |
2013.08.30 |
| 申请人 |
Chiun Mai Communication Systems, Inc. |
发明人 |
TSENG CHI-SHENG;KUO YI-HUNG;HUNG CHING-MING;WANG KUANG-HSIEN |
| 分类号 |
H04R1/02 |
主分类号 |
H04R1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A speaker assembly configured for assembled to a housing, the housing defining a through hole and a receiving groove communicating with each other, comprising:
a speaker; and a speaker cover, the speaker being received in the through hole, the speaker cover having an extending edge beyond a peripheral wall of the speaker and being received in the receiving groove. |
| 地址 |
New Taipei TW |
