发明名称 METHOD OF MANUFACTURING AN ORGANIC LIGHT-EMITTING ELEMENT, ORGANIC LIGHT-EMITTING ELEMENT, DISPLAY PANEL, AND DISPLAY DEVICE
摘要 A method of manufacturing an organic light-emitting element is provided. A first layer is formed above a substrate, and exhibits hole injection properties. A bank material layer is formed above the first layer using a bank material. Banks are formed by patterning the bank material layer, and forming a resin film on a surface of the first layer by attaching a portion of the bank material layer to the first layer. The banks define apertures corresponding to light-emitters. The resin material is the same as the bank material. A functional layer is formed by applying ink to the apertures that contacts the resin film. The ink contains an organic material. The functional layer includes an organic light-emitting layer. A second layer is formed above the functional layer and exhibits electron injection properties. The hole injection properties of the first layer are degraded by applying electrical power to an element structure.
申请公布号 US2014231777(A1) 申请公布日期 2014.08.21
申请号 US201414260711 申请日期 2014.04.24
申请人 PANASONIC CORPORATION 发明人 ISOBE Takashi;MISHIMA Kosuke;AKAMATSU Kaori;OHUCHI Satoru
分类号 H01L51/56;H01L51/50 主分类号 H01L51/56
代理机构 代理人
主权项 1. A method of manufacturing an organic light-emitting element, comprising: forming a first layer above a substrate, the first layer having hole injection properties; forming a bank material layer above the first layer using a bank material; forming banks by patterning the bank material layer, and forming a resin film on a surface of the first layer by attaching a portion of the bank material layer to the first layer, the banks defining apertures corresponding to light-emitters; forming a functional layer by applying ink to the apertures, the ink contacting the resin film, the ink containing an organic material, the functional layer including an organic light-emitting layer; forming a second layer above the functional layer, the second layer having electron injection properties; and degrading the hole injection properties of the first layer by applying electrical power to an element structure formed by forming the first layer, forming the bank material layer, forming the banks, forming the functional layer, and forming the second layer.
地址 Osaka JP