| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic element mounting substrate which can be made compact, and to provide an electronic device.SOLUTION: The electronic element mounting substrate has an insulation base 2, and a plurality of via conductors 5 provided on the insulation base 2. Each of the plurality of via conductors 5 includes a first conductor 5a, and a second conductor 5b connected with the first conductor 5a and having a width narrower than that of the first conductor 5a. The plurality of via conductors 5 are arranged so that the first conductor 5a and the second conductor 5b are arranged at the same height position in adjacent via conductors 5, some of the second conductors 5b in adjacent via conductors 5 are arranged at the same height position, and the interval of some of the second conductors 5b is larger than the interval of the first conductor 5a and the second conductor 5b in adjacent via conductors 5. |
