发明名称 CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability between electrodes. ! SOLUTION: Conductive particles 1 according to the present invention each have a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. A region R containing an organic compound and a metal X exists on the conductive layer 3 side of the base material particle 2. The average content of the metal X in the region R is 10 to 90 wt.% inclusive. The average thickness of the region R in a direction connecting the surface and the center C of the base material particle 2 is 10 nm or more. ! COPYRIGHT: (C)2014,JPO&INPIT
申请公布号 JP2014150053(A) 申请公布日期 2014.08.21
申请号 JP20130268432 申请日期 2013.12.26
申请人 SEKISUI CHEM CO LTD 发明人 DOBASHI YUTO
分类号 H01B5/00;H01B1/00;H01B1/22;H01R11/01 主分类号 H01B5/00
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