发明名称 |
CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability between electrodes. ! SOLUTION: Conductive particles 1 according to the present invention each have a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. A region R containing an organic compound and a metal X exists on the conductive layer 3 side of the base material particle 2. The average content of the metal X in the region R is 10 to 90 wt.% inclusive. The average thickness of the region R in a direction connecting the surface and the center C of the base material particle 2 is 10 nm or more. ! COPYRIGHT: (C)2014,JPO&INPIT |
申请公布号 |
JP2014150053(A) |
申请公布日期 |
2014.08.21 |
申请号 |
JP20130268432 |
申请日期 |
2013.12.26 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
DOBASHI YUTO |
分类号 |
H01B5/00;H01B1/00;H01B1/22;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|