| 摘要 |
Provided is a device for preventing cracks and defects when a substrate composed of a hard brittle crystal material is manufactured. A holding means holds both ends of a workpiece, and the distal end of a polishing brush, which is a machining means, is brought into contact with the workpiece and rotated to thereby remove very small cracks present in the surface layer of the workpiece. Grindstone and polishing-brush machining are used in combination in accordance with the shape and dimensions of the workpiece prior to machining, whereby the shape and dimensions can be adjusted and very small cracks can be removed. |
