发明名称 METHOD FOR FORMING BILAYER PATCHES
摘要 A method for injection molding thin materials (sub-millimeter) having low green strength could make certain manufacturing processes significantly more efficient yet has heretofore been unavailable. Provided herein is a method that enables injection molding of thin materials by using a mold with contact surfaces having a low surface energy release agent disposed thereon. The low surface energy release agent may be applied as a coating on a conventional mold or the mold itself or just the contact surfaces thereof may be formed of a low surface energy release material. The method finds particular applicability in making special contour patches for medical and cosmetic implants and prosthetics. A preferred approach involves injection molding a thin layer of unvulcanized material on a cold mold, injection molding a thin layer of vulcanized material on a hot mold, transferring the vulcanized layer to the unvulcanized layer on the cold mold, and removing the combined layers.
申请公布号 US2014234636(A1) 申请公布日期 2014.08.21
申请号 US201414261255 申请日期 2014.04.24
申请人 Applied Silicone Corporation 发明人 Winn R. Alastair;Pasko Nolan
分类号 B29C45/16;A61F2/12;B32B25/20 主分类号 B29C45/16
代理机构 代理人
主权项 1. A method of forming a patch, comprising: injection molding a vulcanized polymer layer using a first mold plate; injection molding a unvulcanized polymer layer using a second mold plate; removing the vulcanized polymer layer from the first mold plate; disposing the vulcanized polymer layer onto the unvulcanized layer while the unvulcanized layer is still on the second mold plate. compressing the vulcanized polymer layer and the unvulcanized polymer layer until the vulcanized polymer layer adheres to the unvulcanized layer to form a patch; and removing the patch from the second mold plate.
地址 Santa Paula CA US