发明名称 FLEXIBLE SUBSTRATE INDUCTIVE APPARATUS AND METHODS
摘要 Flexible substrate inductive apparatus and methods for manufacturing, and utilizing, the same. In one embodiment, the flexible substrate inductive device includes a square shaped ferrite core having four (4) portions of flexible substrate disposed thereon. The disposal of the conductive traces onto the substrate utilizes highly controlled manufacturing processes such that the characteristics of the device, including the spacing and pitch of the windings, can be accurately controlled. The accurate placement of these conductive traces produces an inductive device with highly consistent performance capabilities as compared with traditional wire wound inductive devices. In addition to the performance capabilities provided via the use of flexible substrates utilizing highly automated processes, the flexible substrate inductive devices disclosed herein minimize/eliminate errors associated with traditional wire wound inductive devices.
申请公布号 US2014232502(A1) 申请公布日期 2014.08.21
申请号 US201313801967 申请日期 2013.03.13
申请人 PULSE ELECTRONICS, INC. 发明人 Gutierrez Aurelio;Kuehler Dan;Saboori Mohammad;Abedmanoore Hamlet
分类号 H01F5/00;H01F41/04 主分类号 H01F5/00
代理机构 代理人
主权项 1. A flexible printed substrate inductive device, comprising: a flexible polymer film having a plurality of conductive traces disposed thereon; and a ferrous core; wherein the flexible polymer film is shaped so that the plurality of conductive traces forms one or more electrically conductive windings, the ferrous core disposed such that its use in combination with the one or more windings forms an inductive device.
地址 San Diego CA US