| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of suppressing deterioration in electromagnetic shield effect of a frame-like conductive member at frequencies of a GHZ band, and of improving an external-origin electromagnetic wave resistance of a semiconductor circuit, in a semiconductor package with a metal frame in which a semiconductor is arranged in the frame-like conductive member having an opening.SOLUTION: In a semiconductor package 100 with a metal frame, a frame-like conductive member 2 having an opening 21 is mounted on a substrate 1, and a semiconductor element 3 is arranged inside the conductive member 2. In the semiconductor package 100, an annular wiring pattern 5 is provided at a substrate part outside the opening 21 of the conductive member. An electrostatic coupling capacitance between the annular wiring pattern 5 and the conductive member 2 is equal to or more than that between the semiconductor metal wiring layer and the conductive member 2. The annular wiring pattern 5 and ground wiring of the semiconductor metal wiring layer are electrically connected with each other. |
