| 摘要 |
PROBLEM TO BE SOLVED: To improve deposition efficiency of a plate metal in a roughening treatment. ! SOLUTION: There is a method including a base plating layer forming process for forming a base plating layer having a thickness of more than 0.5 g/m2 and 1.8 g/m2 or less on a copper base material, and a roughened plating layer forming process for forming a roughened plating layer by running the copper raw material in a plating liquid with a speed adjusted so that the Reynolds number of the plating liquid is 1.7×105 to 2.5×105 and depositing roughened particles on the base plating layer. ! COPYRIGHT: (C)2014,JPO&INPIT |
