SURFACE-TREATED COPPER FOIL AND LAMINATE PLATE USING THE SAME, COPPER FOIL, PRINTED WIRING BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

Provided are: a surface-treated copper foil which can adhere satisfactorily to a resin and which has an advantage in that, when the foil has been removed by etching, the resulting resin exhibits high transparency; and a laminate using the foil. This surface-treated copper foil has roughening particles on the surface, said particles being formed by roughening treatment. In the surface-treated copper foil, the surface which has undergone roughening treatment exhibits a TD average roughness (Rz) of 0.20 to 0.80mum and an MD glossiness at 60°of 76 to 350%, and the A/B ratio is 1.90 to 2.40 [wherein A is the surface area of the roughening particles and B is the area of the roughening particles as observed in the planar view from the surface side of the copper foil.]