发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which makes it possible to obtain a molded product having excellent mechanical characteristics, tracking resistance and surface appearance. ! SOLUTION: A polyamide resin composition contains, with respect to (a) 100 pts.wt. of a polyamide resin, (b) 0.1-20 pts.wt. of a compound having a hydroxy group and a carboxyl group wherein a molecular weight is 510 or more, a degree of branching is 0.10-1.0, and a ratio between an acid value (mgKOH/g) and a hydroxyl value (mgKOH/g), (acid value/hydroxyl value), is 0.54-2.90. ! COPYRIGHT: (C)2014,JPO&INPIT
申请公布号 JP2014148559(A) 申请公布日期 2014.08.21
申请号 JP20130016382 申请日期 2013.01.31
申请人 TORAY IND INC 发明人 MASUNAGA ATSUSHI ; NAKAGAWA YASUSHI ; UMEZU HIDEYUKI
分类号 C08L77/00;C08K3/10;C08L67/00 主分类号 C08L77/00
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