SEMICONDUCTOR MODULE

摘要

A semiconductor module including a semiconductor chip having a light receiving device formed at a front thereof and light permeable cover having a front, a back, and a side. The light permeable cover is disposed opposite to the front of the semiconductor chip such that the front of the semiconductor chip is covered by the back of the light permeable cover. The permeable cover is provided at the outer circumferential region of the front thereof and at the side thereof with a light shielding layer. It is possible to prevent the incidence of unnecessary light from the side of the light permeable cover of a CSP and to easily adjust the distance between a lens and the front of the semiconductor chip within tolerance.

主权项

1. A semiconductor module comprising:
a semiconductor chip having an active region formed at a front thereof; an intermediate layer having
a front,a back,a side, and an outer circumferential region at the front of the intermediate layer, the intermediate layer being disposed opposite to the front of the semiconductor chip such that the front of the semiconductor chip is covered by the back of the intermediate layer; an enclosing portion formed of an insulation material, the enclosing portion having
a first portion formed at the outer circumferential region, anda second portion formed on the side of the intermediate layer, a tip end of the second portion extending to a side of the semiconductor chip; a counterpart unit having
a facing surface facing to the intermediate layer, anda support part, fixed to the intermediate layer at the outer circumferential region; and an adhesion layer on the semiconductor chip and having an opening formed at a central portion thereof, wherein the adhesion layer, the intermediate layer, the first portion and the support part are stacked in that stated order on the semiconductor chip, wherein a signal sent from the surface of the counterpart unit is sent to the semiconductor chip through the intermediate layer.