| 摘要 |
A method for producing a carrier card with a removable integrated chip module card has the following steps: - provision of a carrier card in ID1 format made of a single‑layer or multilayer paper, wherein the individual layers have predetermined material properties, and the individual layers are joined by means of waterproof adhesive, -a- production of a cavity, wherein the cavity is single‑staged or multi‑staged, so that at least one outer and one inner subcavity are formed, by -a1- first notching of the carrier card along a contour of the outer subcavity to be made in the carrier card; -a2- removal of paper material within the first contour to produce the outer subcavity to be made in the carrier card; -a4- removal of paper material within a second contour of the inner subcavity to be made in the carrier card; -b- shaping of the removable integrated chip module card(s) in the mini‑SIM, micro-SIM, nano-SIM, and/or embedded-SIM format with notched or through‑notched features and/or webs between each removable integrated chip module card(s) and the remaining carrier card; and -c- adhesive bonding of an integrated chip module into the cavity. |
