CURABLE RESIN COMPOSITION, CURED PRODUCT, SEALING MEMBER SEMICONDUCTOR DEVICE

摘要

The objective of the present invention is to provide a curable resin composition which is capable of forming a cured product that has excellent heat resistance and transparency as well as excellent barrier properties against corrosive gas, in particular. This curable resin composition comprises a polyorganosiloxane (A), an isocyanurate compound (B) and a silane coupling agent (C), the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group. The polyorganosiloxane (A) is preferably a polyorganosiloxane which has a number-average molecular weight (Mn) of 500-4000 as measured by gel permeation chromatography relative to polystyrene standards.