| 发明名称 |
VACUUM CHUCK WITH POLYMERIC EMBOSSMENTS |
| 摘要 |
<p>A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.</p> |
| 申请公布号 |
WO2014126896(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
WO2014US15735 |
申请日期 |
2014.02.11 |
| 申请人 |
ENTEGRIS, INC. |
发明人 |
GLASKO, JOHN;COOKE, RICHARD, A.;LIN, I-KUAN |
| 分类号 |
H01L21/683;H01L21/687 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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