| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing capable of providing an electronic device having excellent long-term reliability.SOLUTION: An electronic device 100 includes: a wiring board 101; a plurality of electronic components 105 mounted to at least one surface 110 of the wiring board 101, in which at least one is a QFP-type package and has a gap 103 between the wiring board 101 and itself; and a sealing material 107 for collectively sealing the gap 103 between the QFP-type package and the wiring board 101, the plurality of electronic components 105, and the wiring board 101, wherein the sealing material 107 is filled in the gap 103. The epoxy resin composition for sealing is used for forming the sealing material 107 constituting the electronic device 100, and includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B) and an inorganic filler (C). |
