| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can be downsized.SOLUTION: A semiconductor device 10 comprises: a first substrate 20 and a second substrate 40 electrically connected with each other via a solder ball 60 with a core; a semiconductor chip 70 mounted on the first substrate 20; a semiconductor chip 71 and a passive element 72 mounted on the second substrate 40; and an antenna 30 electrically connected with the semiconductor chip 71. The antenna 30 comprises: a first wiring part 31, a first through electrode 32, and a first wiring pattern 33 formed on the first substrate 20; a second wiring part 34, a second through electrode 35, and a second wiring pattern 36 formed on the second substrate 40; and the solder ball 60 with a core. |
