| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method which can effectively reduce man-hours in a manufacturing step of an electronic component mounting structure having high connection reliability.SOLUTION: An electronic component mounting method comprises: (i) a step of supplying a cream solder to a plurality of land electrodes; (ii) a step of mounting a first electronic component on a substrate in a manner such that a plurality of first bumps and the plurality of land electrodes are opposite to one another; (iii) a step of supplying a reinforcement material including a thermosetting resin to at least a part of a region of the substrate, which corresponds to a peripheral part of the first electronic component at a height of also touching a peripheral part of a second electronic component; (iv) a step of mounting the second electronic component on a second principal surface of the first electronic component and bringing the reinforcement material into contact with the peripheral part of the second electronic component; and (v) a step of collectively heating the first electronic component and the second electronic component to melt the cream solder, the plurality of first bumps and a plurality of second bumps, and promoting hardening of the thermosetting resin. |
