METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device having a chip laminate in which semiconductor chips are fixed on a state that they are prevented from sliding with each other.SOLUTION: A method of manufacturing a semiconductor device includes: a step of laminating a plurality of semiconductor chips in each of which electrodes (bump electrodes 22) are arranged on at least one surface, thereby electrodes of the respective semiconductor chips are opposed to each other; and a step of pressing and heating the plurality of semiconductor chips in a state that side faces of the plurality of laminated semiconductor chips are guided, thereby fixing the electrodes with each other.