LAMINATED CIRCUIT SUBSTRATE

摘要

A laminated circuit substrate (101) in which a capacitor (C1) and a coil (L1) are provided, and which is manufactured by laminating sheets (11-15), and using an implement (90) to pressure bond the sheets from the vertical lamination direction while heating. The capacitor (C1) comprises a first conductive pattern (32A) and a second conductive pattern (33A) which oppose one another by sandwiching thermoplastic resin layers (22, 23). With respect to the laminated circuit substrate (101), a roughening process is performed on: a first main surface (91) of the first conductive pattern (32A), said first main surface opposing the second conductive pattern (33A); and a second main surface (92) of the second conductive pattern (33A), said second main surface opposing the first conductive pattern (32A).