发明名称 MOLDING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a molding method which suppresses deformation of a molded article during a process of forming a molded article by laminating layers containing grains and removing a part of the layers.SOLUTION: A molding method where a molded article is formed by binding grains with a binder solution, comprises: a laminate forming step (step S20) where, while laminating a plurality of layers containing grains, a binder solution is coated on a portion of each layer to form a laminate which is separated into a bound section where grains are bound together and a non-bound section; and a removal step (step S30) where a liquid is poured onto the laminate to remove the non-bound section. In the laminate forming step, each layer is formed by a slurry containing grains, an aqueous solvent, and an amphiphilic polymer dissolved in the aqueous solvent (step S21), and an adjustment liquid containing an amphiphilic polymer dissolved in an aqueous solvent is coated on a portion corresponding to an end of the non-bound section at the bound section side so that solubility of the end becomes lower than other sections (step S23).</p>
申请公布号 JP2014148174(A) 申请公布日期 2014.08.21
申请号 JP20140084497 申请日期 2014.04.16
申请人 SEIKO EPSON CORP 发明人 ISHIDA KOHEI ; OKAMOTO EIJI ; HIRAI TOSHIMITSU
分类号 B29C67/00 主分类号 B29C67/00
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