发明名称 HOT-WIRE METHOD FOR DEPOSITING SEMICONDUCTOR MATERIAL ON A SUBSTRATE AND DEVICE FOR PERFORMING THE METHOD
摘要 A hot wire device and method for depositing semiconductor material onto a substrate in a deposition chamber in which the ends of at least two filaments are clamped into a filament holder and heated by supplying current, wherein a voltage for generating an electrical current is applied in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filament materials can be consecutively deposited onto the substrate without opening the chamber.
申请公布号 US2014235036(A1) 申请公布日期 2014.08.21
申请号 US201214004734 申请日期 2012.03.30
申请人 Finger Friedhelm;Schmalen Andreas;Wolff Johannes 发明人 Finger Friedhelm;Schmalen Andreas;Wolff Johannes
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A hot wire method for depositing semiconductor material onto a substrate in a deposition chamber, comprising clamping the ends of at least two filaments into a filament holder, heating the filaments by supplying current, applying a voltage for generating an electrical current in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filaments materials can be consecutively deposited onto the substrate without opening the chamber.
地址 Juelich DE