发明名称 |
HOT-WIRE METHOD FOR DEPOSITING SEMICONDUCTOR MATERIAL ON A SUBSTRATE AND DEVICE FOR PERFORMING THE METHOD |
摘要 |
A hot wire device and method for depositing semiconductor material onto a substrate in a deposition chamber in which the ends of at least two filaments are clamped into a filament holder and heated by supplying current, wherein a voltage for generating an electrical current is applied in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filament materials can be consecutively deposited onto the substrate without opening the chamber. |
申请公布号 |
US2014235036(A1) |
申请公布日期 |
2014.08.21 |
申请号 |
US201214004734 |
申请日期 |
2012.03.30 |
申请人 |
Finger Friedhelm;Schmalen Andreas;Wolff Johannes |
发明人 |
Finger Friedhelm;Schmalen Andreas;Wolff Johannes |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A hot wire method for depositing semiconductor material onto a substrate in a deposition chamber, comprising clamping the ends of at least two filaments into a filament holder, heating the filaments by supplying current, applying a voltage for generating an electrical current in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filaments materials can be consecutively deposited onto the substrate without opening the chamber. |
地址 |
Juelich DE |