| 发明名称 |
LED CHIP RESISTANT TO ELECTROSTATIC DISCHARGE AND LED PACKAGE INCLUDING THE SAME |
| 摘要 |
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. In the light emitting diode chip, the light emitting diode section is disposed together with the inverse parallel diode section. |
| 申请公布号 |
US2014231852(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201414181094 |
申请日期 |
2014.02.14 |
| 申请人 |
SEOUL VIOSYS CO., LTD. |
发明人 |
Suh Duk Il;Kim Kyoung Wan;Yoon Yeo Jin;Woo Sang Won;Kim Shin Hyoung |
| 分类号 |
H01L27/15 |
主分类号 |
H01L27/15 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode chip comprising:
a substrate; a light emitting diode section disposed on the substrate; and an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. |
| 地址 |
Ansan-si KR |
