发明名称 |
CURABLE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that eliminates coloring or discoloration by heat and strength degradation after a humidity test.SOLUTION: (1) The curable composition comprises the following (A) to (E): (A) 100 parts by mass of oligomer having a (meth)acryloyl group and a diene-based or hydrogenated diene-based skeleton; (B) over 400 parts by mass and up to 600 parts by mass of oligomer having no (meth)acryloyl group but having a diene-based or hydrogenated diene-based skeleton; (C) over 100 parts by mass and up to 400 parts by mass of a phenoxy polyethylene glycol (meth)acrylate having a structure of EO (ethylene oxide) chain-(CHCHO)n-, where n is 4 or more; (D) at least one photopolymerization initiator selected from the group consisting of an alkylphenone-based photopolymerization initiator and an acyl phosphine oxide-based photopolymerization initiator; and (E) a phenolic/sulfuric antioxidant. |
申请公布号 |
JP2014148606(A) |
申请公布日期 |
2014.08.21 |
申请号 |
JP20130017967 |
申请日期 |
2013.01.31 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
HISHA YUKI ; FUKAO KENJI ; GOTO KEIJI ; YODA KIMIHIKO |
分类号 |
C08F290/00;B32B27/18;B32B27/30;C08F290/12;C09J4/00;C09J11/06;C09J109/00 |
主分类号 |
C08F290/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|