发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition that eliminates coloring or discoloration by heat and strength degradation after a humidity test.SOLUTION: (1) The curable composition comprises the following (A) to (E): (A) 100 parts by mass of oligomer having a (meth)acryloyl group and a diene-based or hydrogenated diene-based skeleton; (B) over 400 parts by mass and up to 600 parts by mass of oligomer having no (meth)acryloyl group but having a diene-based or hydrogenated diene-based skeleton; (C) over 100 parts by mass and up to 400 parts by mass of a phenoxy polyethylene glycol (meth)acrylate having a structure of EO (ethylene oxide) chain-(CHCHO)n-, where n is 4 or more; (D) at least one photopolymerization initiator selected from the group consisting of an alkylphenone-based photopolymerization initiator and an acyl phosphine oxide-based photopolymerization initiator; and (E) a phenolic/sulfuric antioxidant.
申请公布号 JP2014148606(A) 申请公布日期 2014.08.21
申请号 JP20130017967 申请日期 2013.01.31
申请人 DENKI KAGAKU KOGYO KK 发明人 HISHA YUKI ; FUKAO KENJI ; GOTO KEIJI ; YODA KIMIHIKO
分类号 C08F290/00;B32B27/18;B32B27/30;C08F290/12;C09J4/00;C09J11/06;C09J109/00 主分类号 C08F290/00
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