RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for sealing an optical semiconductor which is excellent in adhesion with an adherend surface and can obtain an optical semiconductor sealing material retaining high luminance in long-time use, and to provide an optical semiconductor sealing material obtained by curing the resin composition, and further to provide an optical semiconductor device sealed with the optical semiconductor sealing material.SOLUTION: A resin composition for sealing an optical semiconductor is a resin composition used as a sealing material for an optical semiconductor. The resin composition contains an epoxy compound, a polysiloxane compound, a (meth)acrylic polymer, and a curing catalyst.