发明名称 Cooling System for a Hand-Held Electronic Device
摘要 A cooling system for a hand-held electronic device includes a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment. A wind driving assembly is mounted in the compartment and includes a frame, a package, and a thermally conductive cover. The thermally conductive cover engages with the frame and the package. An impeller is rotatably arranged in the frame having an outlet hole adjacent to the at least one air outlet. The package receives at least one electronic element that generates heat during operation. The thermally conductive cover includes an inlet hole in communication with an interior of the frame. An air channel is formed between the thermally conductive cover and an interior wall face of the casing. The at least one air inlet intercommunicates with the inlet hole via the air channel.
申请公布号 US2014235156(A1) 申请公布日期 2014.08.21
申请号 US201414177303 申请日期 2014.02.11
申请人 Sunonwealth Electric Machine Industry Co., Ltd. 发明人 Li Ming-Tsung;Lin Shih-Hang
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A cooling system for a hand-held electronic device comprising: a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment; and a wind driving assembly mounted in the compartment, with the wind driving assembly including a frame, a package and a thermally conductive cover, with the thermally conductive cover engaged with the frame and the package, with an impeller rotatably mounted in the frame, with the frame including an outlet hole adjacent to the at least one air outlet of the casing, with the package adapted to receive at least one electronic element, with the at least one electronic element generating heat during operation, and with the thermally conductive cover including an inlet hole in communication with an interior of the frame, wherein an air channel is formed between the thermally conductive cover and an interior wall face of the casing, and the at least one air inlet of the casing intercommunicates with the inlet hole of the thermally conductive cover via the air channel.
地址 Kaohsiung City TW