| 发明名称 |
SUBSTRATE CONVEYANCE APPARATUS AND SUBSTRATE PEELING SYSTEM |
| 摘要 |
Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin. |
| 申请公布号 |
US2014234033(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201414182969 |
申请日期 |
2014.02.18 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
IWASHITA Yasuharu;HIRAKAWA Osamu;SOMA Yasutaka;TAMURA Takeshi;NODA Kazutaka |
| 分类号 |
B65G51/03 |
主分类号 |
B65G51/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate conveyance apparatus comprising:
a plurality of nozzles configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner, and a main body unit provided with the plurality of nozzles, wherein at least surfaces of the plurality of nozzles are formed of a resin. |
| 地址 |
TOKYO JP |
