| 摘要 |
The printed circuit board (100) includes the interposer (2) where the semiconductor element (1) is mounted and the electrode pad (8) is formed on one surface, the printed wiring board (3) where the electrode pad (9) is formed on one surface facing the interposer (2), and the joint material (70) for bonding the electrode pads (8) and (9). The joint material (70) includes the solder layer (60) formed by the solder material (11) and the metal layers (50), (50) provided to the electrode pads (8) and (9). Each metal layer (50) includes the metal particle aggregate (10) in which metal particles are integrated with voids and is formed by filling the voids in the metal particle aggregate (10) with melted solder material (11). It is possible to ensure the height of the solder, improve reliability of the bonding, and downsize the semiconductor device by using such joint material. |
| 主权项 |
1. A stacked type semiconductor device comprising:
a first semiconductor device including a first semiconductor element, and a first interposer where the first semiconductor element is mounted, a first electrode pad is formed on one surface, and an external electrode for connecting to the outside is formed on the other surface; a second semiconductor device stacked on the first semiconductor device, the second semiconductor device including a second semiconductor element, and a second interposer where the second semiconductor element is mounted and a second electrode pad is formed on a surface facing the first interposer; and a joint material configured to bond the first electrode pad and the second electrode pad together, wherein a solder layer and a metal layer bonded to at least one of the first and the second electrode pads are stacked in the joint material, wherein the metal layer includes a metal particle aggregate in which a plurality of metal particles are integrated with voids, and solder which fills the voids in the metal particle aggregate. |
