发明名称 METHOD FOR PRODUCING A SOLDER JOINT
摘要 The invention relates to a method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present; and soldering the at least first component (3) onto the non-blasted positioning region (40), wherein the SACO-blasted region (20) acts as a solder resist.
申请公布号 US2014231976(A1) 申请公布日期 2014.08.21
申请号 US201214348679 申请日期 2012.09.20
申请人 Robert Bosch GmbH 发明人 Michels Daniel;Green Simon
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps: providing the base part (2), partially blasting a surface of the base part (2) using a SACO blasting agent, a blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present, and soldering the at least first component (3) onto the non-blasted positioning region (40), wherein the SACO-blasted region (20) acts as a solder resist.
地址 Stuttgart DE