| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for thinning of a semiconductor wafer, in which the wafer can be firmly coupled to a support in processes of processing such as grinding and easily separated from the support without breakage or damage after the processing.SOLUTION: Compositions containing an adhesive material 2, such as a polyarylene oligomer, a cyclic-olefin oligomer and a vinyl aromatic oligomer, and a release additive 3a, 3b are suitable for temporarily bonding a wafer active side 5 (semiconductor wafer) and a substrate 1. These compositions are useful in the manufacture of electronic devices, where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer. The processed thinned wafer can be easily separated from the substrate. |
