| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can improve location accuracy of a processing position of each of a plurality of processing members on a peripheral part of a substrate principal surface thereby to process a whole area of the principal surface of the substrate with high efficiency without the occurrence of treatment non-uniformity.SOLUTION: In a substrate processing device, fitting positions of first and second chemical nozzles 5, 6 to a swing arm 13, a position of a rotation axis C and a location of a swing axis A are adjusted such that first and second droplet landing positions form a positional relationship which satisfies the following formula (1): L1×L2=r(1) (in formula (1), L1 denotes a distance between the first and second droplet landing positions in relation to a direction along the swing arm 13; L2 denotes a distance between the rotation axis C and the swing axis A; r denotes a radius of a circular region where the droplet landing positions can be scanned by rotation of a spin chuck 3 and swing of the swing arm 13). |
